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Cooler Master
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
SKU
HTK-002-U1-GP
In Stock
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
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Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
| Features | |
|---|---|
| Type | Thermal paste |
| Thermal resistance | 0.8 °C/W |
| Thermal conductivity | 4.5 W/m·K |
| Product colour | White |
| Specific gravity | 2.37 g/cm³ |
| Packaging data | |
| Package width | 102 mm |
| Package depth | 171 mm |
| Package height | 40 mm |
| Quantity per pack | 1 pc(s) |
| Technical details | |
| Thermal resistance | 0.8 °C/W |
| Thermal conductivity | 4.5 W/m·K |
| Weight & dimensions | |
|---|---|
| Package width | 102 mm |
| Package depth | 171 mm |
| Package height | 40 mm |
| Colour | |
| Product colour | White |
| Logistics data | |
| Quantity per pack | 1 pc(s) |