NETAC

Netac Basic DDR4-3200 8G C16

SKU
NTBSD4P32SP-08
In Stock
Basic DDR4-3200 8G C16
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  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • On-board I2C serial presence-detect (SPD) EEPROM
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Databus write cyclic redundancy check (CRC)
  • Temperature controlled refresh (TCR)
  • Command/Address (CA) parity
  • Per DRAM Addressability is supported
  • 8 bit pre-fetch
  • Fly-by topology
  • Command/Address latency (CAL)
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • Gold edge contacts
  • RoHS Compliant and Halogen-Fre
Power
Memory voltage1.35 V
Memory
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Memory layout (modules x size)1 x 8 GB
Internal memory8 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.35 V
Lead platingGold
SPD profileYes
Memory channelsSingle-channel
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Memory layout (modules x size)1 x 8 GB
Internal memory8 GB
Component forPC/Server
Memory form factor288-pin DIMM
CAS latency16
Memory voltage1.35 V
Lead platingGold
SPD profileYes
Memory channelsSingle-channel
ECCNo
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Technical details
Doesn't containHalogen
Compliance certificatesRoHS
Sustainability
Doesn't containHalogen
Weight & dimensions
Width133.3 mm
Height31.2 mm